http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005056941-A1

Outgoing Links

Predicate Object
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2004-10-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbfeb3734b3498fd81ef7b4ab5116bb8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1ed04dd38c1eaf3a0aa8a2f32cf3a08
publicationDate 2005-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2005056941-A1
titleOfInvention Method of fabricating a semiconductor device
abstract This invention relates to Integrated Circuit (IC) processing and fabrication. A device and a method are provided for etching an opening in an insulating layer while depositing a barrier layer on the side walls of the opening without essentially depositing a barrier layer on the bottom of the opening.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9330926-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005048782-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8173547-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9018098-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010047976-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010105209-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010047976-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008081483-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9865472-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8614151-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8669183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009176375-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007281474-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009184089-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8598037-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10062602-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010105208-A1
priorityDate 2001-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6518174-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5904154-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6037257-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005048782-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002106895-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6750137-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5818071-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5674787-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002119664-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6577009-B1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID70434
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID444749
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449798576
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419549006
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419544406
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9863
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24637
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419546728

Total number of triples: 60.