Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76879 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5386 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2021-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c086bbfde3730927f8473109354e8fb7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_993e2527fd7f5ea3d0af171590db8a2d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea4240fc067182d6be3000605e02056a |
publicationDate |
2022-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2022336360-A1 |
titleOfInvention |
Diagonal vias in semiconductor structures |
abstract |
A semiconductor structure including a first conductive layer, a second conductive layer situated above the first conductive layer, and a via extending diagonally between the second conductive layer and the first conductive layer to electrically connect the first conductive layer to the second conductive layer. |
priorityDate |
2021-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |