| abstract |
An object of the present invention is to provide a semiconductor device in which a fine electrode is formed on a semiconductor element and a through electrode is formed on the outside of the semiconductor element, so that mounting on a wiring board or stacking of semiconductor devices is easy. A semiconductor device having a semiconductor element, a metal pad and a metal wiring on the semiconductor element electrically connected to the semiconductor element, the metal wiring being electrically connected to a through electrode and a solder bump, wherein a first photosensitive insulation is provided on the semiconductor element. layer is formed, a second photosensitive insulating layer is formed on the first photosensitive insulating layer, and the first photosensitive insulating layer and the second photosensitive insulating layer are repeated represented by the following formulas (1) and (2) It relates to a semiconductor device formed of a photocurable resin composition containing a silicone polymer compound having units, a photoacid generator, a solvent and a crosslinking agent. |