| abstract |
A substrate is provided having vias in communication with surface contacts or bumps. After the bonding material paste is pushed over the area array of contact portions on the substrate through the holes in the screen, the screen is biased against the substrate as the paste is heated to transfer the bonding material onto the contact. Alternatively, after the bonding material paste is pushed into the screen, the substrate is placed on the screen with the area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bump. The bonding material may be a solder paste, a conductive adhesive paste, or a transparent liquid bond paste. The substrate may be a coated metal substrate, a flexible or rigid organic substrate, or a semiconductor chip substrate to form an insulating surface. Further, the substrate may be a computer chip, a chip carrier substrate, or a circuit board substrate. The process may also be used to produce attachment structures, circuit boards, thermal grid array modules, ball grid array modules, and flip chips of a preceding element that includes a government processing system. |