| abstract |
During the manufacture of a semiconductor package, a semiconductor wafer comprising a plurality of bond pads on the surface of the wafer is provided and the surface of the wafer is covered with a dielectric material to form a dielectric layer over the bond pads. Portions of the dielectric layer corresponding to locations of the bond pads are removed to form a plurality of wells, and each well forms a through hole between the top and bottom surfaces of the dielectric layer to expose each bond pad. It is configured to. A conductive material is then deposited into the wells to form a conductive layer between the top surface of the dielectric layer and the bond pads. Thereafter, the semiconductor wafer is individualized to form a plurality of semiconductor packages. |