| abstract |
A semiconductor device includes a substrate, a main circuit disposed over a front surface of the substrate, and a rear power output circuit disposed over a rear surface of the substrate. The rear power delivery circuit includes a first utility power line for delivering a first voltage, a second utility line wiring for delivering a second voltage, a first local power line wiring, and a first switch coupled to the first line power line and the first local power line wiring. The first utility power lead wiring, the second utility power lead wiring, and the first local power lead wiring are embedded in a first back insulating layer disposed over the back surface of the substrate. The first local power supply wiring is coupled to the main circuit for supplying the first voltage through a first silicon via (TSV) that passes through the substrate. |