| abstract |
Microelectronic assemblies, and related devices and methods are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a first die and a second die, the first die including a first side and a second side; the second die including a first side and a second side Two sides, wherein the second die further includes a plurality of first conductive contacts at the first side and a plurality of second conductive contacts at the second side, and the second A die is between first level interconnect contacts of the microelectronic assembly and the first die. |