patent/KR-20190076516-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190076516-A

Outgoing Links

Predicate	Object
assignee	http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37
classificationCPCAdditional	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
classificationCPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-02005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636
classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485
filingDate	2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e023a2526af21ce4f7d0cf251557c3cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f2b6cf3f394f465de064bdb9ee0c3b2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ecd9ee45051dfa99d9c7699d837ec257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a733d1b11b8cd652889332327386e0cd http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e49b311c9703d98ac920ada1f4ca6cbf
publicationDate	2019-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20190076516-A
titleOfInvention	Semiconductor Device having a Structure for Insulating Layer under Metal Line
abstract	A via plug formed in the substrate; And a metal layer for wiring formed at an end of the via plug, wherein an insulating structure is disposed under the metal layer for wiring, wherein the insulating structure has a different layered structure depending on a positional relationship with the metal layer for wiring, .
priorityDate	2017-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140041970-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017005054-A1
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415776239 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID82895

Total number of triples: 32.