http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102019103481-B4

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filingDate 2019-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber DE-102019103481-B4
titleOfInvention Via sizes to reduce the risk of bridging and improve performance
abstract Semiconductor device with: a first gate structure (250), a second gate structure (251) and a third gate structure (260), each extending in a first direction (Y); a first gate via (VG1) which is arranged on the first gate structure (250), wherein the first gate via (VG1) has a first size (401); a second gate via (VG2) disposed on the second gate structure (251), the second gate via (VG2) having a second size (402) that is larger than the first size; a third gate via (VG3) disposed on the third gate structure (260), the third gate via (VG3) having a third size (403) that is smaller than the second size but larger than the first size; a first source contact (320) which is arranged adjacent to a first side of the first gate via (VG1); a first drain contact (321) which is arranged adjacent to a second side of the first gate via (VG1) which is opposite to the first side; and a second drain contact (330) which is arranged adjacent to a first side of the third gate via (VG3); in which the first gate, the first gate via (VG1), the second gate and the second gate via (VG2) are components of a first circuit cell, the third gate and the third gate via (VG3) are components of a second circuit cell, and the first circuit cell and the second circuit cell are different types of circuit cells.
priorityDate 2018-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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