| abstract |
(A) at least one resin selected from polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, other polyamides, and copolymers thereof, and (D) thermal crosslinking having 3 or more epoxy groups A resin composition comprising an agent, which further comprises (E) a compound having a tertiary amide structure having a molecular weight of 60 or more and 1,000 or less. It is possible to obtain a cured film with high chemical resistance while being excellent in storage stability and storage stability and being curable by heat treatment at a low temperature, and after a reliability test of a device to which the cured film is applied The resin composition which can suppress the fall of the device characteristic in these is provided. |