| abstract |
The present invention aims to provide a semiconductor device in which a fine electrode is formed on a semiconductor element and a through electrode is applied on the outside of the semiconductor element to facilitate mounting of a wiring substrate or lamination of a semiconductor device. The present invention is a semiconductor device having a semiconductor element, and a metal pad and metal wiring on a semiconductor element electrically connected to the semiconductor element, the metal wiring being electrically connected to a semiconductor through a through electrode and a solder bump (Solder bump) The device is made of the following photo-curable resin composition; the photo-curable resin composition is one containing polysilicone polymer compound, photoacid generator, solvent and crosslinking agent; the polysilicone is high The molecular compound includes a first photosensitive insulating layer and a second photosensitive insulating layer. The first photosensitive insulating layer is formed on the semiconductor element, and the second photosensitive insulating layer is formed on the first photosensitive insulating layer. The first photosensitive insulating layer and the second photosensitive insulating layer are those having repeating units represented by the following general formulas (1) and (2). |