| abstract |
A resin composition containing (a) a resin, (b) an antioxidant and (d) a crosslinking agent, wherein the resin (a) is selected from polyimide precursors, polyamides, polyimides, polybenzoxazoles, and copolymers thereof Wherein the crosslinking agent (d) is a crosslinking agent having a phenolic hydroxyl group in one molecule and a substituent having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Resin composition. A resin which is capable of obtaining a fine pattern and capable of curing at a low temperature of 250 DEG C or less while being excellent in in-plane uniformity of the pattern and capable of obtaining a patterned cured film having high adhesion and high adhesion even after reliability evaluation, Lt; / RTI > |