| abstract |
The present invention provides a photosensitive resin composition and a pattern-cured film that have properties that are comparable to those of a cured film at a high temperature and that suppress corrosion of copper and copper alloys such as metal wiring and metal layers. A manufacturing method and an electronic component are provided. A photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by the general formula (1) (wherein U or V represents a divalent organic group, U and V At least one is a group containing an aliphatic chain structure having 1 to 30 carbon atoms.), (B) a photosensitizer, (c) a solvent, and (d) a heterocyclic compound, a thiourea, and a mercapto. And at least one compound selected from the group consisting of compounds having a group. [Chemical 1] [Selection figure] None |