| abstract |
A resin composition comprising (a) a resin, (b) an antioxidant, and (d) a crosslinking agent, wherein the (a) resin comprises a polyimide precursor, a polyamide, a polyimide One or more kinds of resins among amines, polybenzoxazoles, and copolymers thereof, wherein the (d) crosslinking agent has a phenolic hydroxyl group in one molecule and has a phenolic hydroxyl group at two ortho positions of the phenolic hydroxyl group A crosslinking agent of a substituent with a molecular weight of 40 or more. To provide a resin composition capable of obtaining fine patterns and capable of curing at a low temperature of 250°C or lower, having excellent in-plane uniformity of the obtained patterns, and having high elongation even after reliability evaluation (ie, an accelerated test in practical use) A patterned cured film with high efficiency and high adhesion to metal wiring. |