| abstract |
Various semiconductor chip input/output structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip (15) that has a first conductor pad (85) and a passivation structure (45). A second conductor pad (120) is fabricated around but not in physical contact with the first conductor pad (85) to leave a gap (125). The second conductor pad (120) is adapted to protect a portion of the passivation structure (45). |