| abstract |
A semiconductor device wiring member, a semiconductor device composite wiring member, and a resin-encapsulated die capable of reliably mounting a miniaturized (fine) semiconductor chip and reducing manufacturing costs A semiconductor device is provided. A semiconductor device wiring member 10 electrically connects an electrode 15A on a semiconductor chip 15 and an external wiring member 21. Such a semiconductor device wiring member 10 includes an insulating layer 11, a metal substrate 12 disposed on one side of the insulating layer 11, and a copper wiring layer 13 disposed on the other side of the insulating layer 11. ing. A semiconductor chip mounting portion 11 </ b> A is formed on the copper wiring layer 13 side of the insulating layer 11. The copper wiring layer 13 includes a first terminal portion 13D connected to the electrode 15A on the semiconductor chip 15, a second terminal portion 13E connected to the external wiring member 21, a first terminal portion 13D, and a second terminal portion 13E. And a wiring portion 13C for connecting the two. [Selection] Figure 1 |