| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1606
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0665
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28512
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-16 |
| filingDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b132967f0098d33f63f28e90dd58dc0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d4b346ea9e5a33486fe3f00de7ca851
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79be576ffe632e3d823ca1b5f64dcc1a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_275785f8ec935799923bac63d94b2857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f7a69094fb07cd10249c68ab1916b1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92288cb94e47b07eb3320a60dce73219 |
| publicationDate |
2017-04-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20170037444-A |
| titleOfInvention |
Hybrid interconnect and electric device employing the same |
| abstract |
A connection structure and an electronic device using the same are disclosed. The disclosed connection structure includes a non-metallic material layer, a metal layer, and a graphene layer formed between the non-metallic material layer and the metal layer to connect the non-metallic material layer and the metal layer. A first bonding layer including a metal material is interposed between the graphene layer and the non-metallic material layer and between the graphene layer and the non-metallic material layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11626502-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11069619-B2 |
| priorityDate |
2015-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |