| abstract |
The method includes forming a plurality of dielectric layers; Forming a plurality of redistribution lines in the plurality of dielectric layers; Forming stacked vias in the plurality of dielectric layers, wherein the stacked vias form a continuous electrical connection through the plurality of dielectric layers; Forming a dielectric layer over the stacked vias and the plurality of dielectric layers; Forming a plurality of bonding pads in the dielectric layer; And bonding the device die to the first portion of the dielectric layer and the plurality of bonding pads through hybrid bonding. |