| abstract |
A semiconductor device including a rewiring pad is provided. A semiconductor device includes a semiconductor substrate including a chip region and an edge region, a lower insulating film disposed on the semiconductor substrate, a chip pad disposed on the lower insulating film in the chip region, and the lower insulating film. An upper insulating layer disposed on the chip region and having a first opening exposing the chip pad in the chip region and a second opening exposing the lower insulating film in the edge region; and the chip pad in the first opening; The rewiring pad may include a via portion disposed in the first opening and a pad portion extending from the via portion to the upper surface of the upper insulating layer. [Selection] Figure 5B |