| abstract |
A resin composition which is composed of (A) one or more resins selected from among polyimides, polyimide precursors, polybenzoxazoles, polybenzoxazole precursors, other polyamides and copolymers of these compounds, and (D) a thermal crosslinking agent having three or more epoxy groups, and which additionally contains (E) a compound that has a tertiary amide structure and a molecular weight of from 60 to 1,000 (inclusive). The present invention provides a resin composition which has excellent storage stability and post exposure stability, and which is able to be cured by a heat treatment at low temperatures and is still capable of forming a cured film that has high chemical resistance. In addition, this resin composition is able to suppress decrease in the device characteristics of a device after a reliability test, if the device is provided with a cured film of this resin composition. |