| abstract |
A resin composition comprising (a) a resin, (b) an antioxidant (d) a crosslinking agent, wherein the (a) resin is selected from polyimide precursors, polyamides, polyimides, polybenzoxazoles, and copolymers thereof (d) crosslinking agent is a crosslinking agent having a phenolic hydroxyl group in one molecule and a substituent having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group, resin composition. A resin from which a fine pattern can be obtained, and a low-temperature curing of 250° C. or less is possible, the pattern is excellent in in-plane uniformity, and a cured patterned film with high elongation and high adhesion to metal wiring is obtained even after reliability evaluation, which is an accelerated test for practical use. A composition is provided. |