patent/TW-201637147-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201637147-A

Outgoing Links

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filingDate	2016-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5201f826073776d9217965a0836afadc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3af2f9293fde7b35b443e77972606132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd25304c7c5376e926771e4cd21199ef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa71b2b9fcc295ab8145bf727a217411 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_02fd6e247c50a74a9519fc3f161f0f78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fb9d54ca142583fa94977ad75f099ec6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f620600b5ff0da6f9a95cdfd74bc8ec5
publicationDate	2016-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201637147-A
titleOfInvention	Semiconductor package using contacts in the encapsulant openings of the electroplated sidewalls
abstract	The present invention provides a semiconductor package and method of fabricating the same that includes contacts in an encapsulant opening in an electroplated sidewall, substantially as shown in at least one of the figures and/or in conjunction with the figures The description of at least one of the figures in the formula is more fully presented in the scope of the patent application.
priorityDate	2015-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 78.