| abstract |
The present invention provides a multilayer device, a multilayer body, and a method for manufacturing a multilayer device which ensure the bonding strength and have excellent heat dissipation properties. The multilayer device includes a multilayer body electrically connected to a plurality of semiconductors, the semiconductor has a surface provided with a plurality of terminals, and the plurality of terminals includes a terminal that connects the semiconductors to each other and is electrically connected, and a terminal that connects the semiconductors to each other and is not electrically connected The area ratio of the plurality of terminals on the surface of the semiconductor provided with the plurality of terminals is 40% or more, and the area ratio of the terminals of the plurality of terminals where the semiconductors are bonded and electrically connected is less than 50%. |