http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20140050511-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a16f72268f5a1eb4f08073323a474668 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2013-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1713a44254b4d327a263b3a00c55431 |
| publicationDate | 2014-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20140050511-A |
| titleOfInvention | Method of manufacturing circuit board and chip package and circuit board prepared by the same |
| abstract | The present invention provides a method for manufacturing a circuit board which includes the steps of preparing a base substrate which includes a core layer and a conductive layer which is formed on at least one side of the core layer and includes an internal circuit pattern; forming a laminate material to cover the conductive layer; collectively forming at least one cavity, which exposes the core layer and the conductive layer, on the laminate material; forming a laminate by hardening the laminate material on which the cavity is formed; and forming a conductive layer with an external circuit pattern on the outside of the laminate. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20180079569-A |
| priorityDate | 2012-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.