abstract |
The present invention relates to a nonconductive polymer membrane, a nonconductive polymer paste and a semiconductor package comprising the same. The present invention provides a nonconductive polymer membrane containing zinc (Zn) particles having an average particle size of from about 1 nm to about 200 nm in a nonconductive polymer substrate in the form of a membrane, and a semiconductor package comprising the same. When the nonconductive polymer film and the nonconductive polymer paste of the present invention are used, a semiconductor package having excellent electrical connection characteristics and high reliability can be manufactured at low cost through a simple process. |