| abstract |
An object of this invention is to provide the manufacturing method of the semiconductor device which can suppress generation | occurrence | production of the void in the interface of a semiconductor element and an underfill sheet, and can manufacture highly reliable semiconductor device. This invention is a manufacturing method of a semiconductor device provided with a to-be-adhered body, the semiconductor element electrically connected with this to-be-adhered body, and the underfill material which fills the space between this to-be-adhered body and this semiconductor element, A support material and this support A preparatory process for preparing a sealing sheet comprising an underfill material laminated on a material, a circuit surface on which a connection member of a semiconductor wafer is formed, and an underfill material of the sealing sheet are 10000 Pa or less in a reduced pressure atmosphere, 0.2 MPa or more, and 40 ° C. A thermocompression step of thermocompression bonding under the above-described thermocompression temperature, a dicing step of dicing the semiconductor wafer to form a semiconductor element having the underfill material, and a space between the adherend and the semiconductor element And a connecting step of electrically connecting the semiconductor element and the adherend through the connection member while being filled with a filling material. |