Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af687fe044ae3a57bd114c92fc1ec3b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7df2ff9466924c9c7221073fa18fb94a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e164afd50d1c9941ab64b2ea44747aeb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_888f52db110dbefacc4cee8f378e36ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c1e49aee5e8b4d0893942406354c171 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5b57e43d2ae021e971426b2bcdf2cd48 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-04941 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2518 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01077 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19015 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate |
2012-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f22e1a50edfd3ee04f98a4824a6b4e05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7109abe61cd9d438a19f9c054f99adb1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d29809eb07e948fbbd9f9a716039ffa http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a722ee422513a4f8eb76974b73fb332 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7048c312f5102470980bb11b568783e8 |
publicationDate |
2013-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8592311-B2 |
titleOfInvention |
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures |
abstract |
A semiconductor wafer contains a substrate having a plurality of active devices formed thereon. An analog circuit is formed on the substrate. The analog circuit can be an inductor, metal-insulator-metal capacitor, or resistor. The inductor is made with copper. A through substrate via (TSV) is formed in the substrate. A conductive material is deposited in the TSV in electrical contact with the analog circuit. An under bump metallization layer is formed on a backside of the substrate in electrical contact with the TSV. A solder material is deposited on the UBM layer. The solder material is reflowed to form a solder bump. A wire bond is formed on a top surface of the substrate. A redistribution layer is formed between the TSV and UBM. The analog circuit electrically connects through the TSV to the solder bump on the back side of the substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9373564-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10833144-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9548283-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11637172-B2 |
priorityDate |
2007-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |