| abstract |
The present invention provides an underfill material and a sealing sheet having the same, which are capable of mitigating the difference in thermal response behavior between a semiconductor element and an adherend, and for mounting a semiconductor element, and a semiconductor device using the underfill material Production method. Regarding the underfill material of the present invention, the haze before the thermosetting treatment is 70% or less, and the storage elastic modulus E' [MPa] and the thermal expansion coefficient α [ppm/K after heat hardening treatment at 175 ° C for 1 hour. ] The following formula (1) is satisfied at 25 °C. 10000<E'×α<250000[Pa/K]...(1) |