| abstract |
The present application relates to stacked interposer structures and related microelectronic device assemblies, methods, and electronic systems. An interposer includes a semiconductor material and includes a cache memory below a location on the interposer for the host device. Memory interface circuitry may also be located below one or more locations on the interposer for memory devices. Also disclosed are microelectronic device assemblies incorporating such interposers and including a host device and a plurality of memory devices, and methods of making such microelectronic device assemblies. |