Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-06181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10954 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06544 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13009 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1403 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05571 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 |
filingDate |
2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_deda62f3b4d66e220cbf3172aa746261 |
publicationDate |
2014-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2014346680-A1 |
titleOfInvention |
Forming of an electric connection of the via type |
abstract |
A method and an electronic component including: a substrate including at least a hole at least partially going through a thickness of the substrate; an electrically conducting element positioned in the hole and configured to form an electric connection through the hole, wherein the electrically conducting element includes an electrically conducting and self-supporting pillar with a height oriented according to the thickness of the substrate; and a space between at least a part of the wall of the hole and a part of a peripheral wall of the pillar. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015115460-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015115459-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9257335-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015235898-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318414-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9318413-B2 |
priorityDate |
2011-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |