| abstract |
An object of this invention is to provide the manufacturing method of the board | substrate provided with the through electrode of the structure in which a through electrode is provided in the semiconductor substrate at all, and a fault does not arise at all.n n n Forming a metal post 18a on the temporary substrate 10 in a state capable of being peeled from the temporary substrate 10, and a regular substrate provided with a through hole 20x at a position corresponding to the metal post 18a. By placing 20 on the temporary substrate 10, the process of inserting the metal post 18a on the temporary substrate 10 into the through-hole 20x of the regular substrate 20, and the temporary substrate 10 by the metal post By peeling from (18a), the process of obtaining the through electrode 18 which consists of the metal post 18a which penetrates the normal board | substrate 20 is included.n n n n Defects, defects, temporary boards, metal posts, regular boards |