| abstract |
A semiconductor wafer includes a substrate having a plurality of active elements formed thereon. An analog circuit is formed on the substrate. The analog circuit may be an inductor, a metal-insulator-metal capacitor, or a resistor. The inductor is made of copper. A through substrate via (TSV) is formed in the substrate. A conductive material is deposited on the TSV in electrical contact with the analog circuitry. Under bump metallization (UBM) is formed on the substrate backside in electrical contact with the TSV. A solder material is deposited on the UBM layer. A solder material is deposited on the UBM layer. The solder material is reflowed to form a solder bump. A wire bond is formed on the substrate surface. n n Semiconductor device, circuit element, wafer, interconnect structure, solder bump, solder ball |