| abstract |
The invention discloses one and wear silicon through hole, it comprises an insulating barrier, and continuous print lining is on a sidewall of a recessed via structure; One barrier layer, continuous print is covered with this insulating barrier; One discontinuous crystal seed layer, it has one first position, is positioned at the one end open place of this recessed guide hole structure; One discontinuous dielectric layer, it partly covers this sidewall of this recessed via structure; And a conductive layer, insert this recessed via structure. |