| abstract |
All pins are inspected for through electrodes in manufacturing a semiconductor device. A plurality of copper post bumps 5 electrically connected to a metal layer 1n formed on a front surface 8a side of a wafer 8 and a plurality of through electrodes 1c formed on the opposite back surface 8b side. Each of the plurality of bumps 1e is electrically connected to the plurality of bumps 1e electrically connected to the metal layer 1n (metal layer 1m) with each electrode of the plurality of copper post bumps 5 short-circuited. Probing is performed to perform a second probe test. Thereby, conduction confirmation between each electrode of the plurality of bumps 1e is performed. [Selection] Figure 9 |