patent/TW-201212181-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201212181-A

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34
filingDate	2011-06-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c81db8d6143b7e403256e3252d5d78a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_202ac6285aef6fc822af8aa4db50dc42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_920fdcb9b8bfcc2457844a17446173ca
publicationDate	2012-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201212181-A
titleOfInvention	Stacked interconnect heat sink
abstract	An electronic device includes an integrated circuit and a heat spreader. The integrated circuit includes a substrate with an active via located therein. The heat spreader includes a thermally conductive core. The active via is connected to a corresponding heat spreader via that passes through the thermally conductive core.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I614860-B
priorityDate	2010-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID409357749 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID9214

Total number of triples: 44.