Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1094 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48229 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15321 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06537 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1058 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
filingDate |
2019-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84887896e35334c08cc3b0049e2e3ac4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ca21bbc2e6d8b795895c51b0dd91f5f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a73bbfabd3582180b4a398ff37016f27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_478d8857edd1125f6fd1ac2462e41f04 |
publicationDate |
2020-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2020027813-A1 |
titleOfInvention |
Microelectronics package with a combination heat spreader/radio frequency shield |
abstract |
Described herein are microelectronics packages and methods for manufacturing the same. The microelectronics package may include a base package, an ancillary package, and an electrically isolated metal layer. The base package may include a base die. The ancillary package may include an ancillary component. The ancillary package may be located on top of the base package. The electrically isolated metal layer may be located at least partially within a layer of the base package such that a portion of the electrically isolated metal layer contacts at least one surface of the base die and is located in between the base die and the ancillary component. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11004786-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022223491-A1 |
priorityDate |
2018-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |