| abstract |
Apparatus and methods related to conformal coating of radio frequency (RF) modules are disclosed. In some embodiments, a module may include an overcoat film formed over an RF component mounted on a packaging substrate. The wrap film may also cover a surface mount device (SMD), such as an RF filter implemented as a die-scale surface acoustic wave (SAW) device (CSSD). The module may also include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer may be electrically connected to the ground plane of the package substrate through the SMD. An opening can be formed in the overcoat film over the SMD; and a conductive layer can conform to the opening to electrically connect the conductive layer to the upper surface of the SMD, thereby facilitating a ground connection. |