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publicationNumber US-2011014749-A1
titleOfInvention Method for Packaging Semiconductor Dies Having Through-Silicon Vias
abstract An integrated circuit structure is provided. The integrated circuit structure includes a die and an anisotropic conducing film (ACF) adjoining the back surface of the die. The die includes a front surface; a back surface on an opposite side of the die than the front surface; and a through-silicon via (TSV) exposed through the back surface of the die.
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