| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d867860bffab62f9197a9ffeb03f7999 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-26175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1815
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73259
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49833
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-82039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73227 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49805
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2020-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b96bf7b4ee1818a079daf13cbb0334f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72888eb16ad7e06aeef101841b2fa22a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_863f7eb0ad403061d851467d2a8f75fc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_259d50b5b75a078d056313c6fa31f4ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d43d47455d766d2fc05db5760d30e22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8eb704a50e4da73714bbce9674ebfe67 |
| publicationDate |
2021-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021166992-A1 |
| titleOfInvention |
Methods and structures for increasing the allowable die size in tmv packages |
| abstract |
A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized. |
| priorityDate |
2011-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |