| abstract |
An integrated circuit device wherein a substrate for an active element and a substrate for a passive element are connected makes it possible to moderate alignment accuracy requirement and to efficiently use an element forming region.nAn integrated circuit device (100) is provided with a first substrate (51) and a second substrate (31). The first substrate (51) is composed of a semiconductor substrate, and on one surface of the first substrate (51), an active element section (52) is formed, and a first through electrode (57), which is electrically connected with the active element section (52) and penetrates the first substrate (51) are formed. On one surface of the second substrate (31), a passive element is formed, and a second through electrode (37), which is electrically connected with the passive element and penetrates the second substrate (31), is also formed. The other surface of the first substrate (51) and the other surface of the second substrate (31) are arranged to face each other, and the first through electrode (57) and the second through electrode (37) are electrically connected to each other. |