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filingDate 2006-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2009-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_80599d93cd30ae31317a6d4b0e78298a
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publicationDate 2009-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7638867-B2
titleOfInvention Microelectronic package having solder-filled through-vias
abstract An apparatus, a method, and a system associated with microelectronic packaging are disclosed herein. In various embodiments, a microelectronic package may include a die having one or more through-vias, each filled with a solder material; a substrate; and one or more solder bumps disposed between and electrically connecting the substrate and a backside of the die.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014290038-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010109103-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9027226-B2
priorityDate 2006-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 47.