| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89bef4cc6e32c137b96fee53ba2a9863
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f129015433cafd05f3ad118862c4ba4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f667651ddf268b631978a41061a4b7bf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_280397dc1352060c4a92bd606fb47699
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1434
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1432
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0652
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| filingDate |
2016-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ca444cf1de8bce2f4758f30417bff06f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d4fd88ca269835d8142bc93934edab8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_275e17d3cf0d1974564eb8485f8b12ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a387e9d118d8399bd731ed2c32d4ca24 |
| publicationDate |
2018-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2018063154-A1 |
| titleOfInvention |
3d stacked-in-recess system in package |
| abstract |
A system in package device includes a landed first die disposed on a package substrate. The landed first die includes a notch that is contoured and that opens the backside surface of the die to a ledge. A stacked die is mounted at the ledge and the two dice are each contacted by a through-silicon via (TSV). The system in package device also includes a landed subsequent die on the package substrate and a contoured notch in the landed subsequent die and the notch in the first die form a composite contoured recess into which the stacked die is seated. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020029096-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3736863-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10943792-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11652057-B2 |
| priorityDate |
2016-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |