| abstract |
A kind of IC-components, including single semiconductor substrate；Form the device layer in the positive side of the single semiconductor substrate；Form the redistribution layer on the dorsal part of the single semiconductor substrate；The silicon reach through hole (TSV) in single semiconductor substrate is formed, it is electrically coupled to the device layer and the redistribution layer；The logical memory interface (LMI) on the dorsal part of single semiconductor substrate is formed, it is electrically coupled to the redistribution layer；With MEMS of the formation on the dorsal part of single semiconductor substrate, it is electrically coupled to the redistribution layer. |