http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011129918-A

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99505f5f312672820e9f78c254c00a4d
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
filingDate 2010-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8412d23841de483874d8dacd04a7a1
publicationDate 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2011129918-A
titleOfInvention Manufacture of a TSV interconnect structure comprising an insulating outer portion and a conductive region located within and separated from the outer portion
abstract The present invention relates to a method for manufacturing an interconnect structure. The method of manufacturing an interconnect structure according to the present invention is located inside a substrate (100), at least one trench (103, 105) forming a closed outline and inside the closed outline. Including the formation of at least one hole (102, 104), wherein the trench and the hole are separated by a region of the substrate, and the method includes filling the trench with a dielectric material (111); Filling with material (117, 122). [Selection] Figure 2D
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016167564-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015216251-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015216252-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013251539-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016531439-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014093392-A
priorityDate 2009-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007123857-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10223833-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012525696-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006165025-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID104727
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Total number of triples: 30.