patent/US-9607959-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9607959-B2

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498
filingDate	2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cb7a4e61a5a12c1ac521fbac20d7473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_158b8e0661beed560ef00cd7fc193058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7d1ebaf67fc775b9bda14d5a6f6ca305
publicationDate	2017-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9607959-B2
titleOfInvention	Packaging device having plural microstructures disposed proximate to die mounting region
abstract	An example packaging device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of microstructures are disposed proximate a side of the integrated circuit die mounting region. The plurality of microstructures each include an outer insulating layer over a conductive material. An example packaged semiconductor device includes a substrate having an integrated circuit die mounting region disposed thereon. A plurality of columnar microstructures are disposed on the substrate perpendicular to a major surface of the substrate and proximate a side of the integrated circuit die mounting region. An underfill material is disposed between the substrate and the integrated circuit die.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11545455-B2
priorityDate	2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14829 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559214

Total number of triples: 77.