| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6bccde8faf102dc15841e2b65cb63ba0 |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16251
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16237
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0792
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-092
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00904
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
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| filingDate |
2018-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7424996a7cc6ad11712ec230496541c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc4b990bfac684ecd958590dc1b2fd54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7b7d908abd48f5180c70fa0114dc67ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7af1ef70a33795612b5aa200421dba45 |
| publicationDate |
2020-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10662056-B2 |
| titleOfInvention |
Semiconductor device and method of forming microelectromechanical systems (MEMS) package |
| abstract |
A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die. Alternatively, the second semiconductor die is mounted to an interposer disposed over the interconnect structure. |
| priorityDate |
2014-03-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |