| abstract |
In a semiconductor device having a multilayer wiring board in which a semiconductor chip is embedded, a technique capable of realizing the thinning of the multilayer wiring board is provided. A feature of the present invention is that in a semiconductor device in which a bump electrode BMP is formed on a main surface (element formation surface) of a semiconductor chip CHP embedded in a chip embedded wiring board EMPAC1, a back surface of the semiconductor chip CHP is formed. The insulating film DAF is formed on the surface opposite to the main surface. This eliminates the need to form the prepreg PG on the back surface of the semiconductor chip CHP, so that the effect of reducing the thickness of the chip embedded wiring board EMPAC1 in which the semiconductor chip CHP is embedded can be obtained. [Selection] Figure 1 |