| abstract |
The present invention relates to a semiconductor device and an electronic circuit device. The semiconductor device according to the embodiment includes a plurality of first semiconductor wafers, an organic resin provided between the first semiconductor wafers, and a first semiconductor. Above the wafer, the wiring layer of the first semiconductor wafer is electrically connected to each other, and the first semiconductor unit provided with a plurality of circuit board connection terminals provided on the upper portion of the wiring layer is fixed to the wiring held between the first semiconductor unit. The range of the circuit board connection terminal on the layer side includes a second semiconductor wafer and a second semiconductor unit electrically connected to the first semiconductor unit. |