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Object |
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| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065
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| filingDate |
1997-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1997-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bd06d9b7a63e4b28f5ed438d32c02f28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_871c933656ef7fc4bc08048d1c8c2f58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4b62a5f339a0a2d9d58fe3837b9dc65 |
| publicationDate |
1997-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5699234-A |
| titleOfInvention |
Stacking of three dimensional high density interconnect modules with metal edge contacts |
| abstract |
A method for fabricating a stack of circuit modules includes providing a plurality of substrates having module interconnection layers. Each of the substrates has a circuit chip with chip pads positioned therein and an electrically conductive feed-through line extending from a first surface of the substrate to a second surface of the substrate with the first surface being perpendicular to the second surface. Each of the module interconnection layers is situated over a respective first surface of each of the substrates and includes a module dielectric layer having module vias therein and a module pattern of electrical conductors extending through the module vias to couple the selected chip pads to the feed-through line. The plurality of substrates are stacked. A side interconnection layer is applied over a side surface including the second surfaces of the substrates. The side interconnection layer includes a side dielectric layer having side vias therein aligned with predetermined ones of the feed-through lines and a side pattern of electrical conductors extending through the side vias. |
| isCitedBy |
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014097544-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2002117753-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0075985-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8781983-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9679242-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018125775-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7180165-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110140255-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003094704-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6295220-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011079912-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013056247-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6037044-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004097078-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7127807-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106653731-B
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7741152-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190094423-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007172986-A1 |
| priorityDate |
1995-05-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |