| abstract |
A system and method for packaging semiconductor devices are provided. Embodiments include forming vias on a carrier wafer, and attaching a first die on the carrier wafer and between the first two of the vias. A second die is attached over the carrier wafer and between the second two of the vias. The first die and the second die are encapsulated to form a first package, and at least one third die is connected to the first die or the second die. A second package is connected to the first package on the at least one third die. |